Printed Circuit Board Bending Test Jig

Evaluation of Bending Strength of Electronic Components and Printed Circuit Boards

Add Bookmark

Substrate Guide Bending Test Jig

Evaluation of Bending Strength of Electronic Components and Substrates

Features

  • Can perform 3- and 4-point testing of Substrates.

    • Can measure resistance values while simultaneously measuring Substrate strength. (optional)
    • Can calculate critical bending and other test parameters.
    • Can perform cycle bending test.
{"title":"Downloads","description":"Download the latest brochure.","source":"product","key":3452,"max":"30","filter_types":["brochures"],"link_title":"View other Downloads","link_url":"","pdf_links":[]} {"title":"Applications","source":"product","key":3452,"max":"3","filter_types":["applications","application_note","posters"],"link_title":"Learn more","link_url":false,"config_list":[],"page_links":[],"column_title":"Documents"} {"title":"Technical Documents","source":"product","key":3452,"max":"3","filter_types":["technical","technical_reports","white_papers","primers"],"link_title":"Learn more","link_url":"#tbaleAnchor_technical","config_list":[],"page_links":[],"column_title":"Documents"} {"title":"Manuals","source":"product","key":3452,"max":"3","filter_types":["manuals"],"link_title":"Learn more","link_url":"#tbaleAnchor_manual","config_list":[],"page_links":[],"column_title":"Documents"}